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682
Overview of Co-design Considerations for ESD Protection in System-in-Packages (SiPs)终稿

Huang Xiaozong*

全体主题 > Device and Circuit Reliability

680
Threshold Voltage Instabilities in Perpetual Switching of Low-Voltage Thin-Film Transistors with Solution-Processed In2O3 Channel Layer终稿

Sang Lam*

全体主题 > Device and Circuit Reliability

656
Effects of different energy proton irradiation on DC characteristics of InP-based HEMT终稿

Yinghui Zhong*

全体主题 > Device and Circuit Reliability

654
A New dual directional SCR with high holding voltage for High Voltage ESD protection终稿

Shiyu Song*, Feibo Du, Fei Hou, Wenqiang Song, Zhiwei Liu, Jizhi Liu

全体主题 > Device and Circuit Reliability

652
Compact and Compound SCR structure for full chip ESD protection终稿

Xiaoyu Dong*, Feibo Du, Fei Hou, Wenqiang Song, Zhiwei Liu, Jizhi Liu

全体主题 > Device and Circuit Reliability

651
Enhanced LVTSCR with High Holding Voltage in Advanced CMOS technology终稿

Meichen Huang*, Feibo Du, Zhiwei Liu, Jizhi Liu, Fei Hou, Wenqiang Song

全体主题 > Device and Circuit Reliability

645
A Novel Highly Reliable 12T SRAM Bitcell Design终稿

Jianwei Jiang*, Dianpeng Lin, Jun Xiao, Shichang Zou

全体主题 > Device and Circuit Reliability

641
Failure Analysis for GaAs MMIC Amplifier with Metallized Via Hole终稿

Ting He*

全体主题 > Device and Circuit Reliability

622
A Review of Radiation Effects in Double-SOI Technologies全文被拒

Yang Huang*, Binhong Li, Bo Li, Jiantou Gao, Xiaohui Su, Hainan Liu, Zhengsheng Han, Jiajun Luo

全体主题 > Device and Circuit Reliability

619
Effect of trench bottom implantation on the reliability of trench MOSFET全文被拒

Gong Xueqin*

全体主题 > Device and Circuit Reliability

610
An SET Generation Circuit with Tunable Pulse Width终稿

Xiaohui Su, Bo Li*, Hainan Liu, Binhong Li, Lei Wang, Jiajun Luo, Zhengsheng Han

全体主题 > Device and Circuit Reliability

609
Investigation of Electrical Performance and Reliability of Memristors by Tuning Compliance Current During Electroforming Process终稿

Yuqi Wang, Wei Xu, Yihao Chen, Yi Tong*, Fei Gao, Xinwei Liu, Liqun Lu, Yuefeng Li, Dawei Du, Rong Wang, Mingmin Shi, Lvyang Zhou, Jin Zhou, Miucheng Zhang, Xiang Wan, Xiaojuan Lian

全体主题 > Device and Circuit Reliability

596
An Adaptive Single Event Upset(SEU)-Hardened Flip-Flop Design终稿

Man Zhang*, ZhongJie Guo, WanCheng Xu

全体主题 > Device and Circuit Reliability

574
Instability of Transfer and Low Frequency Noise Characteristics under Positive Bias in the InZnO Thin Film Transistors终稿

Yayi Chen*

全体主题 > Device and Circuit Reliability

568
Bonding Wires for Power Modules: from Aluminum to Copper终稿

Nan Jiang*, Zilan Li

全体主题 > Device and Circuit Reliability

重要日期

  • 会议日期

    06月12日

    2019

    至

    06月14日

    2019

  • 06月12日 2019

    初稿截稿日期

  • 06月14日 2019

    注册截止日期

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Xi'an University of Technology
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