EDSSC 2017 is the 13th in a series of very successful conferences initiated by IEEE ED/SSC Hong Kong joint Chapter. EDSSC 2017 continues the EDSSC tradition as a multidisciplinary forum for the exchange of ideas, research results, and industry experience in the broad areas of electron devices and solid-state circuits and systems. The technical program includes invited talks by famous scientists and contributed papers. All accepted papers will be invited to submit to the IEEE Xplore database.
Honorary Chair
Hong Hocheng, National Tsing Hua University, Taiwan
Juin J. Liou, University of Central Florida, USA
General Chair
Chih-Wen Lu, National Tsing Hua University, Taiwan
Technical Program Chairs
Kea Tiong (Samuel) Tang, National Tsing Hua University, Taiwan
Po-Tsun Liu, , National Chiao Tung University
Technical Program Co-Chair
Xinnan Lin, Peking University Shenzhen Graduate School
Paul K. Yu, Univ. of California, San Diego, USA
Local Arrangement Chairs
Po-Hung Chen, National Chiao Tung University
Ya-Hsiang (Sean) Tai, National Chiao Tung University
Publication Chair
Chih-Fang Huang, National Tsing Hua University, Taiwan
Financial Chair
Jenny Yi-Chun Liu, National Tsing Hua University, Taiwan
International Advisory Committee Chairs
Peter Lai, Hong Kong University, Hong Kong
Mansun Chan, Hong Kong University of Science & Technology
Hei Wong, City University of Hong Kong, Hong Kong
Charles Surya, Hong Kong Polytechnic University, Hong Kong
Cary Yang, Santa Clara University, USA
Steve S. Chung, National Chiao Tung University
Meng-Fan Chang, National Tsing Hua University, Taiwan
Chao Sung Lai, Chang Gung University, Taiwan
Technical Program Committee
John Dallesasse, University of Illinois Urbana Champaign, USA
JianJang Huang, National Taiwan University, Taiwan
Ting Mei, Northwestern Polytechnical University, China
Adrienne D. Stiff-Roberts, Duke University, USA
Charles Surya, The Hong Kong Polytechnic University, Hong Kong SAR
Daniel Wasserman, University of Texas at Austin, USA
Paul Yu, University of California at San Diego, USA
Ehtan Ahn, University of Texas at San Antonio, USA
Ming Liu, University of California at Riverside, USA
Gang Li, The Hong Kong Polytechnic University, Hong Kong SAR
Shadi Dayeh, University of California at San Diego, USA
Jr-Hau He, King Abdullah University of Science and Technology
Juzer Vasi, Indian Institute of Technology, Bombay, Mumbai, India
Joyce Poon, University of Toronto Canada
Can Bayam, University of Illinois Urbana Champaign, USA
Shyh-Chiang Shen, Georgia Institute of Technology, USA
Kaikai Xu, University of Electronic Science and Technology of China, Chengdu, China
Sasan Fathpour, University of Central Florida, Florida, USA
Kawanishi Tetsuya, Waseda University, Japan
Shih-Hsu Huang, Chung Yuan Christian University, Taiwan
Wei-Kai Cheng, Chung Yuan Christian University, Taiwan
Xiao-Dong Huang, Southeast University, China
Hsin-Hsin Hsieh, Industrial Technology Research Institute, Taiwan
Jian-Chiun Liou, National Kaohsiung University of Applied Sciences
Special Session
3D Packaging and Integration
Session Chair: Prof. Chen, Kuan-Neng, National Chiao Tung University
Nanotechnology and Sensor
Session Chair: Prof. Chao Sung Lai, Chang Gung University, Taiwan
Green Circuits and Systems
Session Chair: Prof. Poki Chen, National Taiwan University of Science and Technology
EDA for Digital and Memory Circuits
Session Chair: Prof. Shih-Hsu Huang, Chung Yuan Christian University
Optoelectronic materials, devices and systems
Session Chair: Charles Surya, Hong Kong Polytechnic University
Magnetic material, device and circuit
Session Chair: Dr. Wing-Shan Tam and Dr. Chi-Wah Kok, Canaan Semiconductor Limited
Front-End of Line (FEOL) / Middle-of-Line (MOL) / Back-End of Line (BEOL) Reliability
Session Chair: Prof. Kin Leong Pey, Singapore University of Technology and Design
Organic/In-organic Materials for Microelectronics and Photonics
Session Chair: Prof. Kuan-Wei Lee, I-Shou University
Prof. Jung-Sheng Chiang, I-Shou University
10月18日
2017
10月20日
2017
注册截止日期
2025年06月06日 中国 Yinchuan
2025 IEEE International Conference on Electron Devices and Solid-State Circuits2019年06月12日 中国 xian
The 15th IEEE International Conference on Electron Devices and Solid-State Circuits2016年08月03日 香港-中国 Hongkong,China
2016年IEEE电子器件和固态电路国际会议2015年06月01日 新加坡
2015年IEEE电子设备和固态电路国际会议
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