Original papers are solicited in the general areas of
(but not limited to): 
Thermal Management:
 Novel Materials: Thermal Vias, Heat Spreaders and
Thermal Interface Materials
 Natural and Forced Convection Air Cooling
 Advances in Compact Air Movers
 Single-Phase Liquid Cooling
 Novel Phase Change Cooling Techniques: Boiling, Heat
Pipes, Thermosyphon, Spray and Jet Impingement
 Microfabricated Thermal Management Devices and
Systems
 Sub-Ambient Cooling: Solid State, Vapor Compression,
Absorption, Adsorption, Thermo-acoustic,
Magnetocaloric 
 Thermal Management in Wireless, Networking,
Computing, Lighting, Harsh Environments, and
Peripheral Hardware.
 Thermal and Energy Management in Data Centers
 Three-Dimensional Electronics
 Advances in Experimental Characterization
 Advances in Computational Characterization: MultiScale Modeling, Compact Modeling, Multi-Physics
Modeling, 
Multi-Objective Design and Optimization
Mechanics:
 Modeling and Simulation for Reliability at Package,
Board, and System Levels
 Failure Mechanics and Damage Modeling
 Experimental Techniques
 Constitutive Models
 Impact, Drop and Vibrational Analysis of Packages, 
Sub-Systems, and Systems
 Solder Profile Modeling, Fatigue Mechanics of
Packages, Interconnects
 Materials Characterization, Simulation, Design
Emerging Technologies:  
 Sensors (Medical, Military, Consumer, Structures,
Diagnostic, etc.)
 Nanotechnology: Thermal, Mechanics, Material and
Process Related Issues in Nanostructures
 Micro-Fluidics
 Fiber-Optics Interconnect Systems & Free Space 
Optical Interconnects
 MEMS: Device and Package Level Reliability Issues
 Integrated Biochips and Bioelectronics
 Medical, Telecommunication, and Automotive Systems
 Space Systems: Earth Orbiting and Deep-Space Missions