Sponsored by the IEEE’s CPMT Society, ITherm 2014 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. ITherm 2014 will be held along with the 64th Electronic Components and Technology Conference (ECTC 2014 – http://www.ectc.net), a premier electronics packaging conference. Dual-registration for ITHERM and ECTC is offered at a substantial discount. In addition to Oral and poster presentations and vendor exhibits, ITherm 2014 includes panel discussions, keynote lectures by prominent speakers, a “Cutting Edge Vendors” session, a Workshop on the Industrial Internet, and professional short courses.