AboutComponents, Circuits, Devices and Systems; Fields, Waves and Electromagnetics; Photonics and Electrooptics; Signal Processing and Analysis
Keywords:Advanced Packaging,Packaging Materials & Processes,Packaging Design & Modeling,Interconnection Technologies,Advanced Manufacturing,Quality & Reliability,Optoelectronics and New Display,Power Electronic,MEMS,Sensors and IoT,Emerging Technologies.
Scope:ICEPT 2022 is a four-day event, featuring technical sessions, invited talks, professional development courses, exhibition, and social networking activities. It aims to cover the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in China.
Sponsor Type:1; 9