The Primary objective of the Conference is to provide an international forum for dissemination of information and scientific results relating to education, research and development activities. It is a tradition for all participants of the seminar to present paper(s) which are published in the proceedings. SIITME is a premier European forum for the exchange of information between senior and young scientists from academic communities and electronic industries on topics related to their experimental and theoretical work in the very wide field of electronics and microelectronics technology and packaging. Based on a unique combination of oral and poster presentations as well as individual meetings, researchers can come together to discuss scientific problems and organize international cooperation in a convenient atmosphere during three conference days.
Emerging Technologies & Trends in Advanced Packaging, Microsystems, Heterointegration, Printed Electronics, Smart Textiles, Healthcare
Components, Assembling, and Manufacturing Technology
Design of Electronic Circuits and Systems
Electronics Simulation & Modelling
Electronics Applications: Optoelectronics, Advanced Communication, Automotive, Aerospace and Power Electronics
Applied Reliability
Challenges in Global Education
10月20日
2016
10月23日
2016
摘要截稿日期
摘要录用通知日期
初稿截稿日期
注册截止日期
2022年10月26日 罗马尼亚 Bucharest
2022 IEEE第28届电子封装设计与技术国际研讨会2021年10月27日
2021 IEEE第27届电子封装设计与技术国际研讨会2018年10月25日 罗马尼亚
2018 IEEE第24届电子封装设计与技术国际研讨会2017年10月26日 罗马尼亚
2017 IEEE第23届电子封装设计和技术国际研讨会2014年10月23日 罗马尼亚
2014 IEEE第20届电子封装设计与技术国际研讨会2013年10月24日 罗马尼亚
2013 IEEE第19届电子封装设计与技术国际研讨会
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