活动简介

The Primary objective of the Conference is to provide an international forum for dissemination of information and scientific results relating to education, research and development activities. It is a tradition for all participants of the seminar to present paper(s) which are published in the proceedings. SIITME is a premier European forum for the exchange of information between senior and young scientists from academic communities and electronic industries on topics related to their experimental and theoretical work in the very wide field of electronics and microelectronics technology and packaging. Based on a unique combination of oral and poster presentations as well as individual meetings, researchers can come together to discuss scientific problems and organize international cooperation in a convenient atmosphere during three conference days.

征稿信息

重要日期

2016-09-01
摘要截稿日期
2016-09-19
摘要录用日期
2016-10-08
初稿截稿日期

征稿范围

  • Emerging Technologies & Trends in Advanced Packaging, Microsystems, Heterointegration, Printed Electronics, Smart Textiles, Healthcare

  • Components, Assembling, and Manufacturing Technology

  • Design of Electronic Circuits and Systems

  • Electronics Simulation & Modelling

  • Electronics Applications: Optoelectronics, Advanced Communication, Automotive, Aerospace and Power Electronics

  • Applied Reliability

  • Challenges in Global Education

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重要日期
  • 会议日期

    10月20日

    2016

    10月23日

    2016

  • 09月01日 2016

    摘要截稿日期

  • 09月19日 2016

    摘要录用通知日期

  • 10月08日 2016

    初稿截稿日期

  • 10月23日 2016

    注册截止日期

主办单位
IEEE
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