The organising committee of SIITME 2017 kindly invites you to submit an abstract/paper to the 2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME). The scientific event will take place in Constanta, Romania on October 26th–29th, 2017.
Emerging Technologies & Trends in Advanced Packaging, Microsystems, Heterointegration, Printed Electronics, Smart Textiles, Healthcare
Components, Assembling, and Manufacturing Technology
Design of Electronic Circuits and Systems
Electronics Simulation & Modelling
Electronics Applications: Optoelectronics, Advanced Communication, Automotive, Aerospace and Power Electronics
Applied Reliability
Challenges in Global Education
Papers meeting the quality criteria will be included in the IEEE Xplore Digital Library and Thomson-Reuters ISI-CPCI.
Abstracts and papers will be reviewed by the international Scientific Committee.
1. Each abstract will be reviewed on:
suitability for one of the topics of the conference
scientific content and level, and the relevance of presented results;
correspondence with the abstract template, English usage and grammar.
Authors of accepted abstracts will be invited to submit a full-length conference paper according to the conference paper template.
2. Papers meeting the following criteria will be published in the Conference Proceedings and will be available through IEEE Xplore:
the comments of the reviewers have been taken into consideration;
originality of the paper is given;
it corresponds with the paper template, English usage and grammar are correct,
signed IEEE copyright form has been submitted.
10月26日
2017
10月29日
2017
摘要截稿日期
摘要录用通知日期
终稿截稿日期
注册截止日期
2022年10月26日 罗马尼亚 Bucharest
2022 IEEE第28届电子封装设计与技术国际研讨会2021年10月27日
2021 IEEE第27届电子封装设计与技术国际研讨会2018年10月25日 罗马尼亚
2018 IEEE第24届电子封装设计与技术国际研讨会2016年10月20日 罗马尼亚 Oradea, Romania
2016 IEEE第22届电子封装设计与技术国际研讨会2014年10月23日 罗马尼亚
2014 IEEE第20届电子封装设计与技术国际研讨会2013年10月24日 罗马尼亚
2013 IEEE第19届电子封装设计与技术国际研讨会
留言