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活动简介

The 12th International Conference on ASIC (ASICON 2017) will be held in Guiyang, China, during Oct. 25-28, 2017. The conference is intended to provide an international forum for VLSI circuit designers, ASIC users, System Integrators, IC manufacturers、Process & Device Engineers and   CAD/CAE tool developers to present their updated progresses, developments and research results in their respective fields. The four-day event features keynote speeches and invited talks on state-of-the-art VLSI circuit、device、process design and manufacturing technologies, regular paper presentations, as well as tutorials delivered by leading experts in the respective fields. The Excellent Student Paper award will be announced at the conference. Additionally, an exhibition on EDA tools, foundry technologies, IC processing/Testing facilities, and novel ASIC products will be held during the conference.

征稿信息

重要日期

2017-06-30
摘要截稿日期
2017-06-30
初稿截稿日期
2017-08-15
初稿录用日期
2017-08-15
终稿截稿日期

征稿范围

Papers are solicited in, but not limited to, the following:

I.  Design Techniques

[1]  VLSI Design and Circuits

  • Low power techniques, high-speed circuits

  • Embedded processors and DSP

  • Chaos/neural/fuzzy-logic circuits

  • Programmable devices (PLD, EPLD, HDPLD, FPGA, etc)

  • NoC

[2]  Analog, Mixed Signal and RF Circuits

  • Data converters (ADCs and DACs)

  • RF circuits(narrowband RF, ultra low power and millimeter-wave circuits (MMDS, 60GHz), RF/IF and power amplifiers, frequency generators, RF switches, power detectors, active antennas )

  • Power systems and power electronic circuits

[3]  Application-Specific SoCs

  • Auto-mobile electronics and Industry Control

  • Biomedical circuits and systems

  • Sensory systems

  • Graph theory and computing

  • Neural systems and Applications

  • Mobile Computing

  • IOT technologies.

[4] Circuits and Systems for Wireless Communications

  • Receivers,transimitters technologies for wireless systems (WLAN, WPAN, WMAN, GPS, DVB/DMB,UWB, Blutooth, GSM/EDGE/CDMA/UMTS/3G/4G base stations and handsets, TV, radio, satellite)

  • RFID

  • ISM band systems

[5] Testing, Reliability, Fault-Tolerance

  • Digital/analog/mix-signal testing

  • Design for testability and reliability

  • Test vector compression and silicon debug and diagnosis

  • Variation-aware design

  • Static and dynamic defect and fault recoverability

[6] Advanced Memory

  • DRAM & SRAM  

  • Flash Memory

  • Ferroelectric Memory

  • Phase Change Memory, RRAM, MRAM

[7] FPGA

  • Tools and Design Technique for FPGA

  • Architectures for FPGA

  • Device technology for FPGA

  • Application of FPGA

II.  CAD Techniques

[8] Circuits Simulation, Synthesis, Verification and Physical design

  • Analog Circuits modeling and simulation

  • Logic synthesis, simulation and formal verification

  • Partitioning, placement and floor planning

  • Routing and detailed physical design

[9] CAD for system, Design for Manufacturing and Testing

  • Embedded systems

  • Mixed technology/domain, reliable and alternative systems

  • Design for manufacturability and testing

III.  New Techniques, New Processing, New Devices and Their Applications

[10] MEMS Techniques

  • Piezoelectric and MEMS application

  • Pyroelectric/IR/optical application

  • Sensors,Chemical and Bio-Chips

[11] Nanoelectronics and Gigascale systems

  • Nano Devices and NEMS

[12] New Devices: Hetrojunction Devices, Fin FET, CNT MTJ Devices,, 3-D integration, etc..

[13] Advanced Interconnection Technology, High K/Metal gate technology and other VLSL New Processing, New technologies .

[14] VLSI application for Energy generation, conservation and control

[15] Processing Modeling & Simulation

IV Other VLSI Design and Device Related Topics

[16] Other Devices Related Topics  [17] Other VLSI Design Related Topics

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重要日期
  • 会议日期

    10月25日

    2017

    10月28日

    2017

  • 06月30日 2017

    摘要截稿日期

  • 06月30日 2017

    初稿截稿日期

  • 08月15日 2017

    初稿录用通知日期

  • 08月15日 2017

    终稿截稿日期

  • 10月28日 2017

    注册截止日期

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