The 12th International Conference on ASIC (ASICON 2017) will be held in Guiyang, China, during Oct. 25-28, 2017. The conference is intended to provide an international forum for VLSI circuit designers, ASIC users, System Integrators, IC manufacturers、Process & Device Engineers and CAD/CAE tool developers to present their updated progresses, developments and research results in their respective fields. The four-day event features keynote speeches and invited talks on state-of-the-art VLSI circuit、device、process design and manufacturing technologies, regular paper presentations, as well as tutorials delivered by leading experts in the respective fields. The Excellent Student Paper award will be announced at the conference. Additionally, an exhibition on EDA tools, foundry technologies, IC processing/Testing facilities, and novel ASIC products will be held during the conference.
Papers are solicited in, but not limited to, the following:
I. Design Techniques
[1] VLSI Design and Circuits
Low power techniques, high-speed circuits
Embedded processors and DSP
Chaos/neural/fuzzy-logic circuits
Programmable devices (PLD, EPLD, HDPLD, FPGA, etc)
NoC
[2] Analog, Mixed Signal and RF Circuits
Data converters (ADCs and DACs)
RF circuits(narrowband RF, ultra low power and millimeter-wave circuits (MMDS, 60GHz), RF/IF and power amplifiers, frequency generators, RF switches, power detectors, active antennas )
Power systems and power electronic circuits
[3] Application-Specific SoCs
Auto-mobile electronics and Industry Control
Biomedical circuits and systems
Sensory systems
Graph theory and computing
Neural systems and Applications
Mobile Computing
IOT technologies.
[4] Circuits and Systems for Wireless Communications
Receivers,transimitters technologies for wireless systems (WLAN, WPAN, WMAN, GPS, DVB/DMB,UWB, Blutooth, GSM/EDGE/CDMA/UMTS/3G/4G base stations and handsets, TV, radio, satellite)
RFID
ISM band systems
[5] Testing, Reliability, Fault-Tolerance
Digital/analog/mix-signal testing
Design for testability and reliability
Test vector compression and silicon debug and diagnosis
Variation-aware design
Static and dynamic defect and fault recoverability
[6] Advanced Memory
DRAM & SRAM
Flash Memory
Ferroelectric Memory
Phase Change Memory, RRAM, MRAM
[7] FPGA
Tools and Design Technique for FPGA
Architectures for FPGA
Device technology for FPGA
Application of FPGA
II. CAD Techniques
[8] Circuits Simulation, Synthesis, Verification and Physical design
Analog Circuits modeling and simulation
Logic synthesis, simulation and formal verification
Partitioning, placement and floor planning
Routing and detailed physical design
[9] CAD for system, Design for Manufacturing and Testing
Embedded systems
Mixed technology/domain, reliable and alternative systems
Design for manufacturability and testing
III. New Techniques, New Processing, New Devices and Their Applications
[10] MEMS Techniques
Piezoelectric and MEMS application
Pyroelectric/IR/optical application
Sensors,Chemical and Bio-Chips
[11] Nanoelectronics and Gigascale systems
Nano Devices and NEMS
[12] New Devices: Hetrojunction Devices, Fin FET, CNT MTJ Devices,, 3-D integration, etc..
[13] Advanced Interconnection Technology, High K/Metal gate technology and other VLSL New Processing, New technologies .
[14] VLSI application for Energy generation, conservation and control
[15] Processing Modeling & Simulation
IV. Other VLSI Design and Device Related Topics
[16] Other Devices Related Topics [17] Other VLSI Design Related Topics
10月25日
2017
10月28日
2017
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