Symposium II: Lithography and Patterning

Resist

1. Resist fundamentals

2. Cost effective photoresist for volume production

3. High performance photoresist

4. Resist adhesion control for advanced process

5. Advanced processing technology

Optical lithography

1. CD and overlay control in process

2. Immersion Lithography

3. Defectivity control

4. Anti-reflection schemes for advanced process

5. Advanced optical exposure tools and light source

6. Computational Lithography

7. Cost effective RET techniques

8. Advanced optical imaging modeling

9. Advanced RET such as multiple patterning and polariztion application

10. Advanced OPC & Source mask optimization

11. DFM solutions and Design Technology Co-optimization for 28nm nod and beyond

12. Emergent Technology

13. EUV

14. Directed Self-assembly

15. Direct-write E-beam

16. Nanoimprint

17. Other novel lithographic techniques and Complementary lithography

Metrology and inspection

1. Overlay, CD, defect, and topography metrology

2. Integrated metrology

3. Advanced process control

4. Computational Metrology and Inspection

Mask technology

1. Cost effective reticles for 32nm and below

2. Mask Defect inspection, repair and CD control

3. Advanced mask blank and EMF effect 

4. OPC for mask for 28nm node and beyond