ASMC is now soliciting abstracts in 20 topic areas from professionals involved in all areas of microelectronics manufacturing. Authors of selected papers will have an opportunity to present their work at the conference. They will also receive an invitation to publish their paper in a special section of ASMC 2017, which will be featured in IEEE Transactions on Semiconductor Manufacturing.
ASMC is the leading international technical conference for exploring solutions to improve the collective micro-electronics manufacturing expertise. The conference provides an unparalleled platform for semiconductor professionals to network and learn the latest information in the practical application of advanced manufacturing strategies and methodologies. IEEE is a technical sponsor of ASMC 2017.
AEPM: Advanced Equipment Processes and Materials
AM: Advanced Metrology
AP/DFM: Advanced Patterning/Design for Manufacturability
APC: Advanced Process Control IE: Industrial Engineering
CFM: Contamination Free Manufacturing
DI: Defect Inspection and Reduction
DM: Data Management and Data Mining Tools
DP: Discrete and Power Devices
ER: Equipment Reliability and Productivity Enhancements
ET/ID: Enabling Technologies and Innovative Devices
FA: Factory Automation
FE: The Fabless Eperience
GF: Green Factory
LM: Lean Manufacturing
MJ: MOL and Junction Interfaces
SM: Smart Manufacturing
YE: Yield Enhancement/Learning
YM: Yield Methodologies
3D/TSV: Packaging and Through Silicon Via
05月15日
2017
05月18日
2017
摘要截稿日期
初稿录用通知日期
初稿截稿日期
终稿截稿日期
注册截止日期
2025年05月05日 美国 New York
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