"Advanced Metallization Conference 2016: 26th Asian Session" will be held in October, 2016.
ADMETA has its over 20 years history of a conference on the state-of-the-art interconnect technology which has contributed considerably on the development of integrated circuits including MPUs, DRAMs and Flash memories. Reliability issues in Low-k / Cu interconnect is still of great importance to meet the demand for high-density interconnect in future ULSIs, and therefore, emerging nano-carbon materials, air-gap technologies, as well as backend devices like MRAMs and ReRAMs embedded in interconnect layers are currently developed. Packaging is also facing to the down scaling of form factor and thus new interconnects bridging from silicon chips and PCB is required. In particular, 3D interconnect technologies based on TSV is attracting much attention as a promising future technology. ADMETA will focus on process, design, reliability, production tool, material and cost-reduction technologies, and discuss both scientific and engineering approaches to solve those issues.