The 18th annual IITC conference will be held May 23 – 26, 2016 in conjunction with the 33rd Advanced Metallization Conference at the DoubleTree Hotel in San Jose, California. It will be preceded by a day-long workshop on Monday, May 23, included in the conference registration fee..  The conference attracts professionals from industry, academia, and national laboratories in semiconductor processing, interconnect design, and equipment development.

The IITC is sponsored by the IEEE Electron Devices Society as a premier conference for interconnect technology. The joint conference will mark the 33rd AMC in an annual series of meetings devoted to leading-edge research in the field of advanced metallization and 3D integration for ULSI IC applications.

IITC/AMC has announced a Call for Papers for work describing innovative developments in the critically important field of interconnections for electronic systems. The conference seeks papers on all aspects of interconnects for device, circuit board and system-level applications. The deadline for submission of abstracts is February 18, 2016.