The Symposium calls for papers in the following areas:

Advanced CMOS Platforms, Interconnect and Backside Power Delivery Network (BSPDN) Technologies

Advanced packaging, Chiplet and Heterogeneous Integration Technologies Including 2.5D and 3D

Analog and Mixed-Signal Circuits

Beyond CMOS Devices That Utilize New Physics Including Spin, Optical and Quantum Computing

Biomedical devices, circuits, and systems

Computing / Processing in Memory

Data converters

Device physics, Characterization, Modeling and Reliability

Devices and Accelerators for ML/DL and New Compute

Digital Circuits, Hardware Security, Signal Integrity, IOs

DTCO and Design Enablement

 Frequency Generation and Clocking Circuits

Memory Technologies, Devices, Circuits, and Architectures

Power Management Devices and Circuits

Processes and Materials for CMOS Scaling and New Devices

Processors and SoCs

Sensors, Imagers, IoT, MEMS, Display Circuits

Wireless and RF Devices Circuits and Systems

Wireline and Optical Transceivers, Optical Interconnects