1 Carbon nanotubes and 2D electronic and optoelectronic devices (e.g. graphene and beyond graphene) 2 Wide bandgap and other emerging semiconductor materials (e.g. ionic materials) based electronic devices: characterization, modelling and design 3 Advanced silicon, integrated passive devices and through substrate via 4 Low-temperature co-fired ceramic and liquid crystal polymer based microwave devices 5 Large-area printing, inkjet printing and 3D printing materials and processes for RF and THz applications 6 Fan-out wafer/panel level packaging for 5G mmWave and IoT, etc. 7 Flexible materials for RF electronics and antennas 8 Engineered metamaterials and plasmonics for absorption, cloaking, and wave manipulation 9 Ferromagnetic materials and superconducting materials 10 Spin-wave and magnetic crystal materials 11 Passive/active microwave and terahertz devices (characterization, fabrications, and applications) 12 Antennas with advanced/complex/artificial materials and processes
Sponsor Type:1
07月23日
2025
07月26日
2025
初稿截稿日期
注册截止日期
2023年11月13日 中国 Chengdu
2023 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications2022年11月13日 中国 Guangzhou
2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications2021年11月15日 中国 Chongqing
2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications2018年07月16日 美国
2018 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications2017年09月20日 意大利 Pavia
2017 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications2016年07月20日 中国 Chengdu, China
2016 IEEE MTT-S International Microwave Workshop Serieson Advanced Materials and Processes for RF and THz Applications
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