Over the past two decades, the IEEE Workshop on Signal and Power Integrity (SPI) has evolved into a forum of exchange on the latest research and developments on design, characterization, modeling, simulation and testing for Signal and Power Integrity at chip, package, board and system level. The workshop brings together developers and researchers from industry and academia in order to encourage cooperation.
In view of previous years success, the Committees are hardworking and keen on the 27th Edition which will be held in Aveiro, Portugal. The SPI 2023 technical program will include both oral and poster sessions, and several prominent experts will be giving keynotes on areas of emerging interest.
Feel free to look into our website for further information about SPI 2023, as well as broadcast the workshop in your institution and to your fellow colleagues and students. It is a pleasure to invite you all to the 27th IEEE Workshop on Signal and Power Integrity and we look forward to your contribution and participation!
Sponsor Type:1; 1; 1; 9
Workshop Chairs
Joana Catarina Mendes
Instituto de Telecomunicações, Aveiro (POR)
Stefano Grivet-Talocia
Politecnico di Torino, Torino (ITA)
Program Chairs
Antonio Maffucci
University of Cassino and Southern Lazio, Cassino (ITA)
Stanislav Maslovski
Instituto de Telecomunicações, Aveiro (POR)
Standing Committee
Uwe Arz
Physikalisch-Technische Bundesanstalt, Braunschweig (GER)
Flavio G. Canavero
Politecnico di Torino, Torino (ITA)
Hartmut Grabinski
Leibniz University Hannover, Hannover (GER)
Stefano Grivet-Talocia
Politecnico di Torino, Torino (ITA)
Antonio Maffucci
University of Cassino and Southern Lazio, Cassino (ITA)
Michel S. Nakhla
Carleton University, Ottawa (CAN)
José E. Schutt-Ainé
University of Illinois, Urbana-Champaign (USA)
Madhavan Swaminathan
Georgia Institute of Technology, Atlanta (USA)
• Modeling and simulation for SI/PI
• Coupled signal and power Integrity analysis
• Noise reduction and equalization techniques
• High-speed link design and modeling
• Power distribution networks
• RF/microwave/mm-wave systems and packaging solutions
• Antennas-in-package and antennas-on-chip
• 3D IC and packages (TSV/SiP/SoC)
• Nano-interconnects and nano-structures
• Electromagnetic theory and modeling
• Transmission line theory and modeling
• Macromodeling, reduced order models
• Electromagnetic compatibility
• Design methodology/flow measurements
• Jitter and noise modeling
• Stochastic/ sensitivity analysis
• Electro-thermal modeling
• Chip-package co-design
• Novel CAD concepts
• Optical interconnects
• AI in electronics design
05月07日
2023
05月10日
2023
初稿截稿日期
注册截止日期
2022年05月22日 德国 Siegen
2022 IEEE 26th Workshop on Signal and Power Integrity2021年05月10日
2021 IEEE 25th Workshop on Signal and Power Integrity (SPI)2019年06月18日 法国 Chambéry
2019 IEEE 23rd Workshop on Signal and Power Integrity2018年05月22日 法国 Brest
2018 IEEE 22nd Workshop on Signal and Power Integrity2017年05月07日 意大利 Baveno,Italy
2017年第21届 IEEE信号和电源完整性研讨会2016年05月08日 意大利 Turin, Italy
2016 IEEE第20届信号和电源完整性研讨会2015年05月10日 德国
2015年IEEE第19届信号和电源完整性研讨会2014年05月11日 比利时
2014 IEEE第18届信号和电源完整性研讨会2013年05月12日 法国
2013年第17届IEEE信号和电源完整性研讨会
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