AboutComponents, Circuits, Devices and Systems; Engineered Materials, Dielectrics and Plasmas
Keywords:Viatrench Patterning,Process integration,Materials and Unit Processes,Dielectrics,Metals,barriers,CMP,PVD,patterning,Reliability and Failure analysis,techniques and methods,Advanced material & process characterization,design-technology co-Process integration,via trench patterning,Materials and Unit Processes,design-technology co-optimization,modelling techniques.
Scope:IITC is sponsored by the IEEE Electron Devices Society as the premier conference for interconnect technology devoted to leading-edge research in the field of advanced metallization and 3D integration for ULSI IC applications. The conference includes papers on all aspects of BEOL/MOL interconnects and metallization, including design, unit process, integration and reliability.
Sponsor Type:1