The Scope and Topics of the Conference

Papers are solicited in, but not limited to the following areas

 VLSI Technologies
1     Advanced CMOS Logic Devices

2     Advanced Process Technologies

3     Advanced Interconnect Technologies

4     Power Devices Technologies

5     2D Devices & Technologies

6     Thin Film Devices and Technologies

7     Compound Semiconductor Technologies

8     Microwave, Millimeter Wave and Analog

9     New Non-Volatile Memory Technologies

10    Flash & 3D Memory Technologies

11    Optoelectronics and Silicon Photonics

12    Sensor, MEMS, and Bioelectronics

13    Emerging Semiconductor Materials & Devices

14    3D Integration

15    Device Technologies for New Computing System

16    Advanced & Heterogeneous Packaging

17    Logic and Power Device Reliability

18    Memory Device Reliability

19    Back-End of Line Reliability & ESD

20    Device Modeling & Simulation

21    Process Modeling & Simulation

22    Design & Technology Co-Optimization

VLSI Circuits & ICCAD

23    Digital Module & Circuit

24    Analog Module & Circuit

25    Mixed-Signal Circuit & ADC/DACs

26    RF Module & Circuit

27    Memory Circuits

28    SoC For IoT and other applications

29    Processor & Advanced Computing System

30    Efficient AI Circuit

31    Wireline and Optical Communication Circuit

32    FPGA Circuits

33    Advanced Clock

34    Signal Processing

35    Chip Test and Reliablity

36    EDA Technology for Circuit Design