The 2018 Electronic Design Process Symposium is the leading forum for advanced chip and systems development and CAD methodologies. 

As we approach the end of Moore’s law scaling, innovative packaging techniques are becoming increasingly important as package, board and other system components drive significant cost reduction. Innovative and smart manufacturing methodologies and flows are also becoming increasingly important. Since algorithmic development is changing rapidly, smart manufacturing enabling reduced NRE and faster time to market is critical. 

Among other things, datacenter applications require heightened cybersecurity. 3DIC chip stacking of host processor and accelerator avoids exposing the bus between them to cyber-attacks. Implementation of machine and deep learning algorithms provides a higher level of defense against hacking. Cybersecurity is also very critical in system designs such as the ones found in automotive applications.