Topics include, but are not limited to, the following technical areas:

1.     Building Blocks for RFIC and MMIC: Si-based RFIC building-block circuit, compound-semiconductor-based MMIC building-block circuit, LNA, PA, VCO, PLL, phase shifter, mixer, RF switch, balun, driver amplifier, etc.

2.     Analog and Mixed-Signal ICs:  power management device and system, OPA, LDO, VGA, amplifier, comparator, filter, AGC, ADC, DAC, divider/multiplier, etc.

3.     Digital ICs: Open code processor, ASIC, FPGA, deep-learning processor, AI in Si, transistor-based DSP, etc.

4.     Modeling, CAD and Testing: Compact models and extraction techniques (silicon based), SPICE models and extraction techniques (non-silicon), modeling technique of GaN, SiC, ASM-HEMT, 2D-material-based devices, quantum devices, NOC, test structures design and model parameter extraction, RF calibration and reliable data acquisi­tion, CAD, EM/TCAD simulation, co-simulation and verification technique, PDK validation.

5.     Semiconductor Process and Device Technologies: CMOS, FinFET, UT-SOI, LDMOS, HEMT, HBT, SiGe, GaAs, InP, GaN, 2D materials, 3G materials, MEMS, device characterization, simulation and FAR, etc.

6.     Memory Device and Process：memory, flash, OTP, MTP, SRAM, DRAM, 3D NAND, MRAM, RRAM, PCRAM, FeRAM, crossbar, DRAM+MCU, etc.

7.     Emerging Device Technologies: 2D materials, green and implantable materials, neuromorphic device, optoelectronic device, device characterization, etc.

8.     Packaging and Module Technologies: MCM, SiP, SoP, TSV, flip -chip assembly, wire bonding, anisotropic conductive film, interconnection technologies, multi-physics and multiscale EM computation/simulation, etc.

9.     Passive ICs and Active Antennas: filters, EM-intensive circuit towards integration in Si-based or compound-semiconductor-based technology, integrated antenna towards massive-MIMO and co-shape design with ICs, on-chip antenna, AIP, integrated passive device, advanced computational EM, etc.

10.  ICs for 5G and Beyond: integrated circuit/system operating at mm-wave (30-300 GHz) and sub-mm-wave (>300 GHz) frequencies, digital beam-steering technique, frequency-generation IC, etc.

11.  ICs for Automotive Electronics: high-voltage IC, IVI, ADAS, OBD, AI interface, ACC, automotive radar, etc.

12.  ICs for High-Speed Connectivity: High-speed data link wireless/wireline/optical transceiver, SerDes, CDRs for high-speed data link, opto-electronic IC, etc.

13.  Sensors, Imagers & ICs for Bio-Medical Applications: Low-power IC, WBAN, wearable device and system, security, biomedical and healthcare application, sensor node, RFID, NFC, ZigBee, WPAN, etc.

14.  Sensors and ICs for IoT & 5G Applications: portable device & system, AI system, etc.