ICCEA 2018 will take place on October 27-29, 2018 in Chengdu, China. It is organized by City University of Hong Kong, Hong Kong, and supported by Xihua University, ChinaThe aim of ICCEA 2018 is to provide a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Civil Engineering and Architecture. This conference provides opportunities for the delegates to exchange new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration.
Conference Chairs
Prof. C. W. Lim, City University of Hong Kong, Hong Kong
Prof. Cees de Bont, Hong Kong Polytechnic University, Hong Kong
Program Chairs
Prof. Alireza Afshari, Aalborg University, Denmark
Prof. Thomas Kang, Seoul National University, South Korea
Prof. Kyung-Jae Shin, Kyungpook National University, South Korea
Local Organizing Chair
Dr. Shenping Chu, Xihua University, China
Technical Committees
Prof. Xiang Guo Wu, Harbin Institute of Technology, China
Prof. Changsoo Kim, Shandong Jianzhu University, China
Prof. Hyeon-Jong Hwang, Hunan University, China
Prof. Woosuk Kim, Kumoh National Institute of Technology, South Korea
Prof. Deuckhang Lee, Nazarbayev University, Kazakhstan
Prof. Ryan Ahn, Texas A&M University, TX, USA
Prof. Leonardo Maximiliano Massone, University of Chile, Chile
Prof. Junwon Seo, South Dakota State University, SD, USA
Dr. Suppachai Sinthaworn, Srinakharinwirot University, Thailand
Dr. Mahdi Moharrampour, Islamic Azad University Buin zahra Branch, Iran
Asst. Prof. M. Yegane, Tarbiat Modares University of Iran, Iran
Dr. Samaila Saleh, Hassan Usman Katsina Polytechnic, Nigeria
Assoc. Prof. Dr. Mohammad Arif Kamal, Aligarh Muslim University, India
2018 the International Conference on Civil Engineering and Architecture (ICCEA 2018) is the premier forum for the presentation of new advances and research results in the fields of theoretical, experimental, and applied multimedia and image processing. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world. Topics of interest for submission include, but are not limited to:
10月27日
2018
10月29日
2018
初稿截稿日期
注册截止日期
留言