647 / 2019-03-28 11:41:42

RF Modeling of the 3D Electro-Photonic Integration based on SOI Photonic TSV Interposer

3D electro-photonic integration,TSV interposer,modeling

全体主题 > Modeling and Simulation Technology

The scheme of 3D electro-photonic integration based on silicon-on-insulator (SOI) photonic through-silicon-via (TSV) interposer provides a shorter communication routing and lower power dissipation with the scenario of vertical interconnects, and therefore has becoming one promising solution for continued scaling of tera-scale optical communication systems. In this work, the radio-frequency (RF) modeling of the routing of TSV and the Si photonic device’s Cu-back end of line (BEOL) is presented and analyzed. Finally, this modeling provides a design framework for optimizing the RF performance of the high speed silicon photonic devices in the electro-photonic 3D TSV integration architecture.