542 / 2019-03-12 19:00:25
Silicon Nitride Stress Liner Impacts on the Electrical Characteristics of AlGaN/GaN HEMTs
Gallium nitride (GaN),High electron mobility transistor (HEMT),Strain engineering
终稿
Wei-Chih Cheng / southern university of science and technology
Tao Fang / southern university of science and technology
Siqi Lei / southern university of science and technology
Yunlong Zhao / The University of British Columbia, Vancouver, BC, Canada
Minghao He / southern university of science and technology
Mansun Chan / Hong Kong University of Science and Technology, Hong Kong, China
Guangrui(Maggie) Xia / The University of British Columbia, Vancouver, BC, Canada
Feng Zhao / Washington State University, Vancouver, WA, USA
Hongyu Yu / southern university of science and technology
Due to the piezoelectric nature of GaN, the two-dimensional electron gas (2DEG) in AlGaN/GaN high electron mobility transistor (HEMT) could be engineered by strain. In this work, SiNx deposited using dual-frequency plasma-enhanced chemical vapor deposition (PECVD) was used as a stressor. The output performance of the devices was dominated by the surface passivation instead of the strain effect. However, the threshold voltage was increased by the liner-induced strain, supporting strain engineering as an effective approach to pursue the normally-off operation of AlGaN/GaN HEMTs.
重要日期
  • 会议日期

    06月12日

    2019

    06月14日

    2019

  • 06月12日 2019

    初稿截稿日期

  • 06月14日 2019

    注册截止日期

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