351 / 2019-02-19 17:49:48

Design of compact 3-D band-pass filters using through glass via technology

through glass via, transformers, integrated passive devices, 3-D integration

全体主题 > RF & Microwave

Due to high loss tangent and low electrical loss, glass interposer is a good candidate for integrated passive devices development. In this paper, a 3-D transformer is established and analyzed. It demonstrates that the proposed transformer greatly benefits from a 3-D design exploiting through glass via (TGV) technology and gains a high inductance density and qualify factors in comparison to conventional techniques. Using the transformer and parallel plate capacitors, a compact coupled resonator band-pass filter is presented for Wireless Local Area Network (WLAN) applications. The mechanical is analyzed and the design guideline is described. The designed filter provides an excellent band pass sensitivity performance and a more compact size of 0.65×0.95×0.15 mm3 in comparison with some reported BPFs.