活动简介
The ICSICT-2018 conference is the 14th in the series aiming to provide an international forum for the presentation and discussion of recent advances in solid-state and integrated circuit technology. The conference will be held on Oct.31-Nov.3, 2018 in Qingdao, China. All aspects of solid-state devices, circuits, processing technologies, materials and other related research are within the scope of the conference. The three days of contributed and invited presentations on the latest developments in diverse fields given in oral and poster sessions, panel discussions on leading edge technology issues, and other activities will provide extensive opportunities for technical information exchange as well as a stimulating environment for mutual communication among participants. Excellent Student Paper Award will be presented at the closing of the conference.
征稿信息
重要日期
The Scope and Topics of the Conference
(Papers are solicited in, but not limited to the following areas)
VLSI Technologies
1. Channel Engineering
2. High-k/Metal gate Technology
3. Advanced Source/Drain Technology
4. Interconnect Technology
5. Advanced 3D Integration
6. Novel Process Technologies
7. Ultra-Thin Body Transistors
8. High Performance CMOS Platforms
9. CMOS Like Novel Devices
10. Advanced FinFETs and Nanowire FETs
11. CNT, MTJ Devices and Nanowire Devices
12. Low- Power and Steep Slope Switching Devices
13. 2D Devices and Technologies
14. Advanced Technologies for Ge MOSFETs
15. Organic semiconductor devices and technologies
16. Compound semiconductor devices and Technology
17. Ultra High Speed Transistors, HEMT/HBT etc.
18. Photoelectron Devices
19. Advanced Power Devices and Reliability
20. Flash Memory
21. 1T Magnetic RAM
22. Resistive RAMs
23. Phase Change Memory
24. 3-Dimensional Memory
25. MEMS Technology
26. Thin Film Transistors
27. Sensors
28. PV and Energy Harvesting
29. Front End of Line (FEOL) Reliability
30. Memory Reliability
31. Back-End of Line and ESD Reliability
32. Device Simulation & Modeling
33. Process Simulation & Modeling
34. Artificial Intelligence (Process & Device)
35. Internet of Things (Process & Device)
VLSI Circuits & ICCAD
36. Processors
37. Analog Circuits
38. SOC
39. PLL and CDR
40. Low-Power Nyquist ADCs
41. Digital Circuits Resilient
42. High-Resolution and High Speed Data Converters
43. Digital Chip-to-Chip and On-Die Interfaces
44. Advanced Clock
45. Artificial Intelligence (Circuits & System)
46. Internet of Things (Circuits & System)
47. FPGA
48. Memory Circuits
49. Advanced Transceivers Techniques
50. EDA
51. RF Circuits and Systems
52. Interference Robust RF Receivers
53. Signal Processing
54. System-Level Modeling & Simulation/Verification
55. System-Level Synthesis & Optimization
56. High-Level/Behavioral/Logic Synthesis & Optimization
57. Physical Design
58. DFM
全部留言
重要日期
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会议日期
10月31日
2018
至11月03日
2018
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06月30日 2018
摘要截稿日期
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06月30日 2018
初稿截稿日期
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07月15日 2018
初稿录用通知日期
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08月15日 2018
终稿截稿日期
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11月03日 2018
注册截止日期
主办单位
承办单位
联系方式
- Prof. Yu-Long Jiang（About paper submission）
- yl******@fudan.edu.cn
- +86*********
- Huihua Yu（About Conference Issues）
- ic******@fudan.edu.cn
- +86*********
历届会议
-
2016年10月25日 中国 Hangzhou, China
2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology
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