This workshop will focus on low-temperature bonding technologies which realize novel device structure by heterogeneous material and device integration and lead to entirely new manufacturing approaches to 3D and module integration of semiconductor devices, photonic systems, and power electronic systems. These bonding technologies have been already used for the mass production of micro devices and have potential applications in wide range of manufacturing industries. 

The workshop invites papers that document new developments in low-temperature bonding technologies, including surface activated bonding (SAB), new device structures and fabrication processes, facilities and technologies for mass-production, and basic science relating to these technologies. Their impact on the paradigm shift in the semiconductor industry and information technologies along with 3D and heterogeneous integration is also of interest. 

Keynote speeches by world-leading researchers will summarize, clarify and share recent technical trends and the basic science of bonding and integration. Similarly to the preceding 1st (2007), 2nd (2010), 3rd (2012), and 4th (2104) workshops, this workshop will be held as a single-track seminar to provide comprehensive information on the latest technologies and applications, as well as business opportunities. 

As a new attempt of the workshop from this year, it is my pleasure to extend an invitation to your students to participate in Student Session on the third day. The session is managed by student steering committee members under the supervision of the organizing commitees. The organizing committee will provide a travel scholarship for students from oversees based on their grant application. Students must be enrolled as a full-time undergraduate or MS/PhD candidate in Spring 2017 to eligible to participate.