396 / 2017-04-25 11:45:11
Investigation into Reliability Assessment of Power Semiconductor for Hybrid DC Switch Application
hybrid DC switch,reliability assessment,power semiconductor,junction temperature,thermo-sensitive electrical parameters
全文录用
Jingcun LIU / Xi'an Jiaotong University
Guogang ZHANG / Xi’an Jiaotong University
Qian CHEN / Xi’an Jiaotong University
Lu QI / Xi’an Jiaotong University
Zheng QIN / Xi’an Jiaotong University
Jianhua Wang / Xi'an Jiaotong University
This paper aims at reliability assessment of power semiconductor in hybrid DC switch. Specific focus is given to temperature measurement of power semiconductor during turn-off via thermo-sensitive electrical parameters. VCE, td(off), and dVCE/dt of IGBT are proposed as the indicator and calibrated. Comparative experiments with thermistor during hybrid DC switch breaking prove the validation of the method.
重要日期
  • 会议日期

    10月22日

    2017

    10月25日

    2017

  • 01月04日 2017

    摘要录用通知日期

  • 03月10日 2017

    初稿录用通知日期

  • 06月30日 2017

    终稿截稿日期

  • 10月25日 2017

    注册截止日期

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