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600 / 2022-03-30 17:33:21
Evaluation of the Insulation Performance of the Disconnector to Ground Based on MD
EPOXY RESIN,MOLECULAR DYNAMICS,THERMODYNAMIC PROPERTIES,MECHANICAL PROPERTIES,DIELECTRIC PROPERTIES
5. High Voltage Insulation System: Liquid, Solid Dielectrics
终稿
Zhijie He / State Grid Zhangzhou Electric Power Supply Company
Xiaohua Ma / School of Electrical Engineering； China University of Mining and Technology
Shifang Yang / North China Electric Power University；Hebei Provincial Key Laboratory of Power Equipment Security Defence
Lujia Wang / China University of Mining and Technology
Ming Zhang / School of Electrical Engineering；China University of Mining and Technology
Epoxy resin materials are selected as the main material of disconnector to ground insulation. In this paper, the molecular model of epoxy resin was built based on molecular simulation technology, and the effects of different electric fields on the thermodynamic, mechanical and dielectric properties of epoxy resins were studied from the microscopic level. The results showed that the glass transition temperature decreased by 55K as electric field reached 0.06V/nm. Higher electric field led to the increase of the thermal conductivity, but the rate gradually decreased as electric field increased. The mechanical properties including Young's modulus, volume modulus and shear modulus decreased by 18.01%, 14.38% and 20.10% respectively when the electric field strength reached its maximum The epoxy resin under high electric field presented higher relative permittivity. At the same time, the increase of the electric field changed the microstructure of epoxy resin, the cohesive energy density decreased and the free volume fraction increased.
重要日期

  • 会议日期

    09月25日

    2022

    至

    09月29日

    2022

  • 08月15日 2022

    提前注册日期

  • 09月10日 2022

    报告提交截止日期

  • 11月10日 2022

    注册截止日期

  • 11月30日 2022

    初稿截稿日期

  • 11月30日 2022

    终稿截稿日期

主办单位
IEEE DEIS
承办单位
Chongqing University
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