555 / 2022-03-29 20:58:55
Application of self-healing copolyimide after electrical damage in intelligent power systems
self-healing,polyimide,electrical damage
终稿
Baoquan Wan / University of Science and Technology Beijing
Jun-Wei Zha / University of Science and Technology Beijing
Purpose/Aim

Electrical and mechanical damage is regarded as the major factor that results in failed polymer insulation. In addition, it shortens the life and reliability of power systems and power electronic devices. The self-healing of thermosetting polyimide after electrical and mechanical damage is rarely reported in the wide application electrical insulation.

Experimental/Modeling methods

In this work, the self-healing of polyimide is realized by copolymerization. The polyimide unit provides high insulation and thermal stability of the material system, and another soft segment structural unit gives self-healing ability. Meanwhile, the self-healing of copolyimide is designed in a medium temperature range that matches the working conditions of many polymer insulating materials in the power system, eliminating the additional stimulation that usually needs to trigger the self-healing response.

Results/discussion

The copolyimide has relatively stable breakdown strength and mechanical strength after self-healing. The self-healing copolyimide film still maintains its good Young's modulus, high thermal stability, and excellent insulation property. In other words, the copolyimide film can still be applied to the scene of high temperature and electric field.

Conclusions

In summary, the self-healing copolyimide with excellent insulation and mechanical properties was successfully prepared. The design of this self-healing polyimide material offers the possibility that intelligent power system and power electronics need longer service life and higher reliability.


 
重要日期
  • 会议日期

    09月25日

    2022

    09月29日

    2022

  • 08月15日 2022

    提前注册日期

  • 09月10日 2022

    报告提交截止日期

  • 11月10日 2022

    注册截止日期

  • 11月30日 2022

    初稿截稿日期

  • 11月30日 2022

    终稿截稿日期

主办单位
IEEE DEIS
承办单位
Chongqing University
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