473 / 2022-03-16 00:10:30
Effect of Silane Coupling Agent Modified Nano-AlN on Electrical and Aging Properties of Silicone Elastomer for High-temperature and High-voltage SiC Electronic Packaging
Silicone elastomer, nanocomposites, electrical properties, thermal aging, quantum chemical calculations
摘要录用
Qilong Wang / Zhejiang University
Xiangrong Chen / Zhejiang University
Xiaofan Huang / Zhejiang University
The pure silicone elastomer and its silane coupling agent modified nanocomposites were thermally aged for 500 h under 250 °C, and the samples before and after aging were subjected to SEM cross-section characterization, thermogravimetric analysis (TGA), DC conductivity and depolarization current testing, space charge measurement, dielectric spectroscopy, DC breakdown experiment and quantum chemical calculations (QCC). The interface state variation between the silicone elastomer matrix and the nano-AlN during the thermal aging process was analyzed. The results show that the pure silicone elastomer produces a large number of chain scission and internal micropores after thermal aging due to thermal decomposition, increasing the shallow trap density. Before thermal aging, an interfacial gap exists between the silicone elastomer matrix and nano-AlN, decreasing the shallow trap depth. The interface state before and after aging has an obvious effect on the thermal stability and electrical properties of the silicone elastomer nanocomposites. Chemical bonds and hydrogen bonds are formed between the silicone elastomer matrix and the nano-AlN after thermal aging, which not only improves thermal decomposition temperature but also increases deep traps depth and density. Compared with the aged pure silicone elastomer, the aged nanocomposites have lower DC conductivity, less space charge accumulation, and higher DC breakdown strength, especially, 3 wt% nanocomposite has the best thermal decomposition inhibition effect.
重要日期
  • 会议日期

    09月25日

    2022

    09月29日

    2022

  • 08月15日 2022

    提前注册日期

  • 09月10日 2022

    报告提交截止日期

  • 11月10日 2022

    注册截止日期

  • 11月30日 2022

    初稿截稿日期

  • 11月30日 2022

    终稿截稿日期

主办单位
IEEE DEIS
承办单位
Chongqing University
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